Immersion Gold Multi Layer PCB Board 8 Layer FR4 TG Material

Multilayer Circuit Board 8 Layer PCB Immersion Gold

Main Features:

Part NO: Multi-Layer PCB0005

Layer Count: 8 Layer PCB

Finished Board Thickness: 1.2MM

Copper Thickness: 1/H/H/H/H/H/H/1

Min Lind Space&Width: 4/4mil

Application Area: Industrial Control

Outline Size: 201.5*120/2PCS

Outline tolerance: +/-0.1mm

Copper wall thickness for plated through holes: 25um

Packing Specifications:

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

Our Product Categories:

1 FR4 substrate PCB : 2 Layer Printed Circuit Board, 4 Layer PCB, 6 Layer PCB, 8 Layer PCB, 10 Layer PCB, 12 Layer PCB, 14 Layer PCB, 16 Layer PCB, 18 Layer PCB, 20 Layer PCB, 22 Layer PCB, 24 Layer PCB, HDI PCB, High frequency PCB.

2 Aluminum Substrate pcb: 1 Layer Aluminum PCB, 2 Layer Aluminum PCB, 4 Layer Aluminum PCB.

3 Flexible PCB: 1 Layer FPC, 2 Layer FPC, 4 Layer FPC, 6 Layer FPC

FR4 TG Multi Layer PCB Board

Multi Layer PCB Board 8 Layer

Immersion Gold PCB

Immersion Gold Multi Layer PCB Board 8 Layer FR4 TG Material Images