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Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

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Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

Brand Name : WITGAIN PCB

Model Number : CeramicPCB0007

Certification : UL

Place of Origin : Guangdong China

MOQ : 1 pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100k pcs/month

Delivery Time : 20 days

Packaging Details : Vacuum bubble bag packaging

Material : Aluminum Nitride

No of layers : 2 Layer

Copper Thickness : 1/1 OZ

Surface technics : ENIG

Board Size : 100mm*100mm

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AIN Ceramic PCB Board Thickness 0.4 MM 1 OZ Copper


Main Features:

1 Part NO: CeramicPCB0007
2 Layer Count: 2 Layer PCB
3 Material Kind: AIN Ceramic
4 Finished Board Thickness: 0.4 MM
5 Copper Thickness: 1/1 OZ
6 PCB Size: 100mm*100mm



Our Product Categories:

Our Product Categories
Material Kinds Layer Counts Treatments
FR4 Single Layer HASL Lead Free
CEM-1 2 Layer/Double Layer OSP
CEM-3 4 Layer Immersion Gold/ENIG
Aluminum Substrate 6 Layer Hard Gold Plating
Iron Substrate 8 Layer Immersion Silver
PTFE 10 Layer Immersion Tin
PI Polymide 12 Layer Gold fingers
AL2O3 Ceramic Substrate 14 Layer Heavy copper up to 8OZ
Rogers, Isola high frequency materials 16 Layer Half plating holes
Halogen free 18 Layer HDI Laser drilling
Copper based 20 Layer Selective immersion gold
22 Layer immersion gold +OSP
24 Layer Resin filled in vias



FAQ:

Q: What is HASL - Hot Air Solder Leveling?

A:

Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

HASL (Hot Air Solder Leveling) is a metallic surface finishing technique, which is performed on the outermost layer of the PCB board to protect the exposed copper surfaces like tracks until the component placement and soldering is completed.

The HASL coating is composed of Solder with 63% Tin and 37% Lead, and during the assembly process, this coating gets dissolved with the soldering material.

Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

The HASL Coating is applied as per the steps below:

  1. The process starts with the immersion of the PCB board into a molten tin/lead solution, where all exposed copper area is covered by this solution.
  2. After that, a Hot Air Leveler (HAL) ensures the uniformity of solder deposit by removing the excess solder from the PCB board, using high pressure hot air knives. The purpose of this is to leave a uniform and thin possible layer on the board.
  3. This coating protects the copper traces from corrosion until the board goes in for the assembly process.

Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

Advantages of HASL:

  • Resistance to copper corrosion
  • Excellent wetting capability during the soldering process
  • Provides excellent quality solder joint (solderability) by making component soldering more effective
  • Economical
  • Can be re-worked easily
  • Suitable for Lead-free PCBs
  • Reduce the chances of PCB failure

Limitations of HASL:

  • It offers high thermal stress to the PCB, which results in defects.
  • Due to the inconsistent thickness of HASL coating, it’s not a feasible solution for SMT component placement.
  • Not suitable for PTH (Plated Through Hole) components.
  • Less environment-friendly

Product Tags:

0.4 MM Ceramic PCB Board

      

1 OZ Copper Ceramic PCB Board

      

Aluminum Nitride PCB

      
Quality Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper for sale

Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper Images

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